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Smart card dual-interface modules

We offer field-proven, plug-and-play packaging technology for high-performing dual-interface smart cards

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Overview

Our dual-interface packages meet all security and robustness requirements for smart cards while also improving dual-interface card designs. Supporting lean production processes and very fast ramp-up, these packages mean that customers do not need to invest in any new or special machinery. In addition, customers benefit from a simplified, secure supply chain with reduced stock levels as one antenna supports all chip/module combinations.

Key Features

  • Universal card antenna
  • High yield and reliability
  • Proven and reliable module process
  • Ultra-thin optimized card design
  • Maximum manufacturing flexibility
  • High ESD robustness
  • Up to 10 years' lifetime

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About

Coil on module for dual interface

Our innovative coil on module (CoM) packaging technology uses a radio frequency link instead of the mechanical/electrical connection typically used between the card antenna and the module. This improves the robustness and long-term reliability of dual-interface (DIF) payment cards and ID documents, while also simplifying card design, manufacturing, and logistics ¨C making these processes more efficient and up to five times faster than with conventional technologies.

Our products come with a broad spectrum of services

We complement our chips and modules with a variety of services. To support antenna design, for example, our experts are happy to provide reference designs or customer-specific designs. In addition, we offer services for radio frequency (RF) verification and testing, as well as reliability testing and failure analysis for cards.

Lean production

The main advantage of our inductive coupling technology is a lean production process. Customers can ramp up production without having to invest in any new or special machinery. In addition, this technology enables simplified, secure supply chains with reduced stock levels as one antenna supports all chip/module combinations.

Proven in the field in vast numbers

Billions of our modules and packages are deployed by customers who demand the highest quality standards.

Coil on module for dual interface

Our innovative coil on module (CoM) packaging technology uses a radio frequency link instead of the mechanical/electrical connection typically used between the card antenna and the module. This improves the robustness and long-term reliability of dual-interface (DIF) payment cards and ID documents, while also simplifying card design, manufacturing, and logistics ¨C making these processes more efficient and up to five times faster than with conventional technologies.

Our products come with a broad spectrum of services

We complement our chips and modules with a variety of services. To support antenna design, for example, our experts are happy to provide reference designs or customer-specific designs. In addition, we offer services for radio frequency (RF) verification and testing, as well as reliability testing and failure analysis for cards.

Lean production

The main advantage of our inductive coupling technology is a lean production process. Customers can ramp up production without having to invest in any new or special machinery. In addition, this technology enables simplified, secure supply chains with reduced stock levels as one antenna supports all chip/module combinations.

Proven in the field in vast numbers

Billions of our modules and packages are deployed by customers who demand the highest quality standards.

Design resources

Developer community

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