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ToF 3D image sensors for consumer and industrial

REAL3? 3D image sensor based on Infineon's ToF (Time-of-Flight) technology - powering the smallest depth-sensing 3D camera modules in the market

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Overview

Infineon's REAL3? 3D imager solutions are based on highly integrated time-of flight (ToF) technology and are part of Infineon¡¯s industry-leading XENSIV? sensor portfolio. Tailored to the consumer and industrial markets, the REAL3? 3D ToF sensors in bare die form unlock a world of exciting applications while setting the highest performance and security benchmarks in new use cases.

Key Features

  • Accurate & precise depth sensing
  • High resolution, long range types
  • Sunlight robust
  • Smallest form factor
  • Lower power consumption
  • On-chip integrated laser safety
  • In-factory calibration
  • Dedicated VCSEL driver portfolio

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About

REAL3? 3D image sensors designed for consumer and industrial markets

REAL3? ToF imager solutions are the perfect fit for the smallest 3D vision camera modules, combining accurate depth measurement over the short and longer range with the lowest power consumption. Infineon REAL3? ToF image sensors deliver unparalleled accuracy and precision for a diverse array of use cases including face recognition, gesture control, augmented reality, robotics, advanced photography, and video. Engineered to cater to both consumer and industrial markets, the bare-die portfolio of REAL3? ToF image sensors boasts high resolution, low power consumption, and compact form factors, meeting the evolving demands of new-generation 3D camera systems. Thanks to its patented technology for suppression of background illumination (SBI), they support camera deployments under all ambient light conditions.?

Embrace the next generation of depth sensing with state-of-the-art ToF 3D image sensors, offering unrivaled performance, immersive experiences, and versatility for a broad spectrum of use cases.?

Dedicated single-chip 3D ToF image sensor portfolio in bare die form

The REAL3? product portfolio for consumer and industrial applications comprises dedicated single-chip 3D image sensors delivered in bare die form. Based on market-leading scalable technology, targeted solutions for different application needs, reliable cost-sensitive system setup and supply chain, REAL3? customers can rely on ensured operational excellence, application fit, and cost sensitivity. The close cooperation and joint expertise of Infineon and pmdtechnologies, complemented by a broad network of global design, software, and manufacturing partners are providing optimal support, high innovation power, and fast time to market to all REAL3? customers. With our joint hardware, software, and service solutions, we are serving the 3D camera module industry and enabling the broadest range of application-targeted 3D image sensing experiences in key markets. You can leverage Infineon¡¯s partner network of module makers and camera design houses for complete ToF camera modules to directly use the 3D point cloud in your application. Please contact our support center for more information.

REAL3??image sensors with highly-optimized VCSEL laser driver

The winning combo: High-resolution REAL3? 3D ToF imager and efficient VCSEL drivers to foster the world's smallest 3D camera modules.?

Our REAL3? image sensors can be combined with our extremely efficient VCSEL driver chips. Our VCSEL drivers have been designed specifically with the Infineon REAL3? imager portfolio in mind. Together, they enable high-performance 3D camera systems: best form factor and power efficiency gains while providing a fully integrated eye safety solution. Highlights include support for single-, dual- and, triple-junction VCSEL, fast switching behavior up to 250 MHz, and ultra-small TSNP-10 packages. These VCSEL drivers combine with REAL3? imagers to offer the smallest module dimensions, ease of integration, and a reduced BOM for optimized cost.

Learn more about Infineon VCSEL driver portfolio
Applications of 3D ToF image sensors in consumer and industrial

The data provided by a Time-of-Flight camera can be used in a variety of applications:

Personal electronics

  • Smartphones and tablets
  • AR headsets and glasses
  • Other wearables?

Service robots

  • Robot vacuum cleaners
  • Social and entertainment robots
  • Edutainment

Payment systems

  • Point of sale (POS)

Home security and monitoring systems

  • Smart door lock and access control
  • Area surveillance
  • People counting

Factory automation

  • Collaborative robots
  • Warehouse and delivery robots
  • Facial authentication
Webinars about 3D ToF sensors in consumer and industrial

In this section, you will find informative and engaging webinars about ToF sensors in consumer and industrial electronics.

From the fundamental of ToF sensors to their practical implementation in real-world depth cameras, our online resources cover a wide range of topics to help you stay up to date with the latest advancements in this rapidly evolving field.


Check out our curated online content and stay ahead in the world of ToF?consumer and industrial sensors:

Smarter self-navigating robots using Hybrid ToF
News about 3D ToF for next generation consumer and industrial devices

Using REAL3? 3D Time-of-Flight imagers from Infineon and pmdtechnologies allows machines to understand the world around them and therefore helps them to make smart decisions. Have a look on the latest market news and press releases about REAL3? ToF bare die sensors for consumer and industrial applications.?

New IRS2976C for optimal quantum efficiency & cost
More market news and press releases

REAL3? 3D image sensors designed for consumer and industrial markets

REAL3? ToF imager solutions are the perfect fit for the smallest 3D vision camera modules, combining accurate depth measurement over the short and longer range with the lowest power consumption. Infineon REAL3? ToF image sensors deliver unparalleled accuracy and precision for a diverse array of use cases including face recognition, gesture control, augmented reality, robotics, advanced photography, and video. Engineered to cater to both consumer and industrial markets, the bare-die portfolio of REAL3? ToF image sensors boasts high resolution, low power consumption, and compact form factors, meeting the evolving demands of new-generation 3D camera systems. Thanks to its patented technology for suppression of background illumination (SBI), they support camera deployments under all ambient light conditions.?

Embrace the next generation of depth sensing with state-of-the-art ToF 3D image sensors, offering unrivaled performance, immersive experiences, and versatility for a broad spectrum of use cases.?

Dedicated single-chip 3D ToF image sensor portfolio in bare die form

The REAL3? product portfolio for consumer and industrial applications comprises dedicated single-chip 3D image sensors delivered in bare die form. Based on market-leading scalable technology, targeted solutions for different application needs, reliable cost-sensitive system setup and supply chain, REAL3? customers can rely on ensured operational excellence, application fit, and cost sensitivity. The close cooperation and joint expertise of Infineon and pmdtechnologies, complemented by a broad network of global design, software, and manufacturing partners are providing optimal support, high innovation power, and fast time to market to all REAL3? customers. With our joint hardware, software, and service solutions, we are serving the 3D camera module industry and enabling the broadest range of application-targeted 3D image sensing experiences in key markets. You can leverage Infineon¡¯s partner network of module makers and camera design houses for complete ToF camera modules to directly use the 3D point cloud in your application. Please contact our support center for more information.

REAL3??image sensors with highly-optimized VCSEL laser driver

The winning combo: High-resolution REAL3? 3D ToF imager and efficient VCSEL drivers to foster the world's smallest 3D camera modules.?

Our REAL3? image sensors can be combined with our extremely efficient VCSEL driver chips. Our VCSEL drivers have been designed specifically with the Infineon REAL3? imager portfolio in mind. Together, they enable high-performance 3D camera systems: best form factor and power efficiency gains while providing a fully integrated eye safety solution. Highlights include support for single-, dual- and, triple-junction VCSEL, fast switching behavior up to 250 MHz, and ultra-small TSNP-10 packages. These VCSEL drivers combine with REAL3? imagers to offer the smallest module dimensions, ease of integration, and a reduced BOM for optimized cost.

Learn more about Infineon VCSEL driver portfolio

Applications of 3D ToF image sensors in consumer and industrial

The data provided by a Time-of-Flight camera can be used in a variety of applications:

Personal electronics

  • Smartphones and tablets
  • AR headsets and glasses
  • Other wearables?

Service robots

  • Robot vacuum cleaners
  • Social and entertainment robots
  • Edutainment

Payment systems

  • Point of sale (POS)

Home security and monitoring systems

  • Smart door lock and access control
  • Area surveillance
  • People counting

Factory automation

  • Collaborative robots
  • Warehouse and delivery robots
  • Facial authentication

Webinars about 3D ToF sensors in consumer and industrial

In this section, you will find informative and engaging webinars about ToF sensors in consumer and industrial electronics.

From the fundamental of ToF sensors to their practical implementation in real-world depth cameras, our online resources cover a wide range of topics to help you stay up to date with the latest advancements in this rapidly evolving field.


Check out our curated online content and stay ahead in the world of ToF?consumer and industrial sensors:

Smarter self-navigating robots using Hybrid ToF

News about 3D ToF for next generation consumer and industrial devices

Using REAL3? 3D Time-of-Flight imagers from Infineon and pmdtechnologies allows machines to understand the world around them and therefore helps them to make smart decisions. Have a look on the latest market news and press releases about REAL3? ToF bare die sensors for consumer and industrial applications.?

New IRS2976C for optimal quantum efficiency & cost
More market news and press releases

Documents

Documents

Design resources

Developer community

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