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Power MOSFET bare die products for industrial and consumer applications

OptiMOS? and StrongIRFET? low and medium voltage power MOSFET bare die

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Overview

Infineon's OptiMOS? and StrongIRFET? 25 V to 250 V power MOSFET bare die families address a broad range of needs from low to high switching frequency applications. Potential applications include motor control, synchronous rectification for AC-DC SMPS, isolated DC-DC converters and OR-ing switches and circuit breakers in 48 V systems.

Key Features

  • Very low on-resistance RDS(on)
  • Fast switching capabilities
  • Outstanding performance
  • Wide range of product offering

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About

Bare die product solution

OptiMOS? bare die products combine very low on-state resistance (RDS(on)) and fastest switching behavior, providing outstanding performance to a wide range of industrial and consumer applications. StrongIRFET? bare die is optimized for low?RDS(on) and high current capability and are ideally suited for low frequency applications requiring performance and ruggedness.

Bare die features and benefits:

  • Suitable for die bond: soldered or glued
  • Backside metallization: NiAg system
  • Frontside metallization: AICu system
  • Passivation: imide (only on edge structure)
Additional information on die

If you are looking for guidance for setting up die assembly process, check out our application note "AN-1061 Bare Die: Die Attach and Wire Bonding".?

For more information regarding StrongIRFET? and OptiMOS? power MOSFET bare die products, please contact the Infineon Service Center or your local sales counterpart.

Infineon Service Center or local sales counterpart

Bare die product solution

OptiMOS? bare die products combine very low on-state resistance (RDS(on)) and fastest switching behavior, providing outstanding performance to a wide range of industrial and consumer applications. StrongIRFET? bare die is optimized for low?RDS(on) and high current capability and are ideally suited for low frequency applications requiring performance and ruggedness.

Bare die features and benefits:

  • Suitable for die bond: soldered or glued
  • Backside metallization: NiAg system
  • Frontside metallization: AICu system
  • Passivation: imide (only on edge structure)

Additional information on die

If you are looking for guidance for setting up die assembly process, check out our application note "AN-1061 Bare Die: Die Attach and Wire Bonding".?

For more information regarding StrongIRFET? and OptiMOS? power MOSFET bare die products, please contact the Infineon Service Center or your local sales counterpart.

Infineon Service Center or local sales counterpart

Documents

Documents

Design resources

Developer community

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