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Power modules

Comprehensive portfolio of IGBT, SiC MOSFET, thyristor, and diode power modules for industrial, automotive, and renewable energy applications

About

Power modules are packages for power semiconductor devices. These devices, also referred to as dies or chips, are made of different semiconductor materials like Silicon (Si) or wide bandgap materials such as silicon carbide (SiC).?

Designers are spoilt for choice by Infineon¡¯s product range. Depending on the system design, they can choose between IGBT or SiC MOSFET-based power modules, also available with automotive qualification. In addition, Infineon offers thyristor and diode power modules, and when looking for integrated solutions, the CIPOS? intelligent power module family should be taken into consideration.

Power modules are ideal in a variety of applications ¨C from small home appliances as low as 20 W up to several MW in transmission and distribution or wind applications.?

Insulated-gate bipolar transistor - or IGBT ¨C chips are soldered or sintered on a substrate that serves as electrical and thermal contact or provides electrical insulation where needed. Most power modules nowadays are IGBT-based and Infineon¡¯s latest IGBT chip generation is TRENCHSTOP? IGBT7.

Infineon has a wide variety of different IGBT power module packages, configurations, and voltages, as well as current classes for an almost infinite number of applications.

Silicon carbide (SiC) MOSFETs belong to wide bandgap materials. Compared to silicon, SiC power modules can achieve higher operating temperatures and switching frequencies for an overall increase in system efficiency. Infineon¡¯s CoolSiC? MOSFET power module solutions serve applications like renewable energies or power supplies.?

Additional we offer silicon based CoolMOS? MOSFET power modules?which is a perfect fit for a cost-performance combination for on-board charger and EV-Aux applications.?

While thyristor/diode modules consist of a diode and a thyristor in one package, bridge rectifier modules are equipped with four diodes. The semiconductor material used is either silicon or silicon carbide Schottky Diodes.?

In addition, Infineon offers thyristor soft starter modules. As the name implies, these power modules are used to gradually increase the voltage at the beginning of the starting sequence.?

Infineon's automotive-qualified power modules are designed to meet the demanding requirements of hybrid and electric vehicles. Our modules, based on leading Si IGBT and CoolSiC technologies, offer best-in-class performance, fast switching, and low switching losses to maximize system efficiency. With AQG 324 qualification, our modules provide high ease of use in designing and manufacturing traction inverters.

Our automotive IGBT modules, including the HybridPACK and EasyPACK product families, feature leading-edge technologies like EDT3, delivering excellent efficiency and high reliability. These modules cover inverter power classes from 30 kW to 250 kW and are available in half-bridge and B6-bridge configurations, making them ideal for plug-in hybrid vehicles and electric cars.

By leveraging Infineon's automotive-qualified power modules, designers can improve system efficiency, reduce costs, and accelerate time-to-market for their electric vehicle applications.

Intelligent power modules (IPMs) consist of silicon IGBTs, MOSFETs, or silicon carbide MOSFET chips in combination with a gate driver in one package. The integration of dies and gate driver ICs results in a smaller system size compared to discrete solutions.

Power modules are packages for power semiconductor devices. These devices, also referred to as dies or chips, are made of different semiconductor materials like Silicon (Si) or wide bandgap materials such as silicon carbide (SiC).?

Designers are spoilt for choice by Infineon¡¯s product range. Depending on the system design, they can choose between IGBT or SiC MOSFET-based power modules, also available with automotive qualification. In addition, Infineon offers thyristor and diode power modules, and when looking for integrated solutions, the CIPOS? intelligent power module family should be taken into consideration.

Power modules are ideal in a variety of applications ¨C from small home appliances as low as 20 W up to several MW in transmission and distribution or wind applications.?

Insulated-gate bipolar transistor - or IGBT ¨C chips are soldered or sintered on a substrate that serves as electrical and thermal contact or provides electrical insulation where needed. Most power modules nowadays are IGBT-based and Infineon¡¯s latest IGBT chip generation is TRENCHSTOP? IGBT7.

Infineon has a wide variety of different IGBT power module packages, configurations, and voltages, as well as current classes for an almost infinite number of applications.

Silicon carbide (SiC) MOSFETs belong to wide bandgap materials. Compared to silicon, SiC power modules can achieve higher operating temperatures and switching frequencies for an overall increase in system efficiency. Infineon¡¯s CoolSiC? MOSFET power module solutions serve applications like renewable energies or power supplies.?

Additional we offer silicon based CoolMOS? MOSFET power modules?which is a perfect fit for a cost-performance combination for on-board charger and EV-Aux applications.?

While thyristor/diode modules consist of a diode and a thyristor in one package, bridge rectifier modules are equipped with four diodes. The semiconductor material used is either silicon or silicon carbide Schottky Diodes.?

In addition, Infineon offers thyristor soft starter modules. As the name implies, these power modules are used to gradually increase the voltage at the beginning of the starting sequence.?

Infineon's automotive-qualified power modules are designed to meet the demanding requirements of hybrid and electric vehicles. Our modules, based on leading Si IGBT and CoolSiC technologies, offer best-in-class performance, fast switching, and low switching losses to maximize system efficiency. With AQG 324 qualification, our modules provide high ease of use in designing and manufacturing traction inverters.

Our automotive IGBT modules, including the HybridPACK and EasyPACK product families, feature leading-edge technologies like EDT3, delivering excellent efficiency and high reliability. These modules cover inverter power classes from 30 kW to 250 kW and are available in half-bridge and B6-bridge configurations, making them ideal for plug-in hybrid vehicles and electric cars.

By leveraging Infineon's automotive-qualified power modules, designers can improve system efficiency, reduce costs, and accelerate time-to-market for their electric vehicle applications.

Intelligent power modules (IPMs) consist of silicon IGBTs, MOSFETs, or silicon carbide MOSFET chips in combination with a gate driver in one package. The integration of dies and gate driver ICs results in a smaller system size compared to discrete solutions.