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Infineon packaging technologies

Infineon offers a wide range of innovative packaging technologies designed to address the diverse needs of modern electronic applications. These advanced packaging solutions ensure optimal performance, reliability, and efficiency for products used in automotive, industrial, consumer, and communication sectors.?

What are examples of packaging technologies?

What are examples of packaging technologies?

TO packages are robust, leaded semiconductor packages commonly used for power devices. They are designed to handle high power and thermal dissipation requirements while maintaining mechanical stability.

  • High thermal performance for efficient heat dissipation.
  • Ensures reliable operation even under extreme environmental conditions.
  • Simple assembly process, making it suitable for a wide range of applications, including automotive and industrial systems.
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TO Packages
TO Packages
TO Packages

These compact leadless or leaded packages are designed for surface mounting on PCBs, enabling high-density designs and automated assembly.

  • Space-saving design for compact electronics.
  • Reduced parasitic inductance due to shorter interconnections.
  • Cost-effective assembly with standard pick-and-place equipment.
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SMD Packages
SMD Packages
SMD Packages

BGA packages use solder balls on the underside of the package for electrical connections, enabling smaller footprints and higher I/O density.

  • Ideal for high-speed and high-power applications due to reduced inductance.
  • Enhanced thermal performance through efficient heat dissipation.
  • High reliability and robust mechanical connections even in demanding environments.
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BGA Packages
BGA Packages
BGA Packages

QFN packages are leadless and designed for low-profile applications. They have exposed die pads for improved thermal and electrical performance.

  • Ultra-thin and space-efficient for compact designs.
  • Excellent thermal and electrical performance due to a direct thermal path.
  • Cost-efficient for high-volume production and suitable for a wide range of applications.
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QFN Packages
QFN Packages
QFN Packages

TOLL packages are designed for high-current and high-power applications, eliminating leads and improving thermal performance through a large exposed pad.

  • Extremely low package resistance for exceptional current-carrying capability.
  • Superior thermal management due to a large copper pad.
  • Compact footprint, making it perfect for applications like motor drives, power supplies, and battery management systems.
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TOLL Packages
TOLL Packages
TOLL Packages

These packages are optimized for high-power applications with leaded connections and large exposed pads for thermal dissipation.

  • High thermal and electrical performance for demanding environments.
  • Reliable operation for automotive and industrial applications.
  • Ease of assembly and rework due to the mechanical design.
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D2PAK and DPAK Packages
D2PAK and DPAK Packages
D2PAK and DPAK Packages

MEMS sensor packaging is specifically tailored for devices such as microphones, pressure sensors, and other precision sensors. These packages are designed with durable structures and further measures that protect the delicate MEMS elements while enabling optimal performance.

  • Highly compact designs enable integration into space-constrained applications, such as smartphones, wearables, and IoT devices.
  • For MEMS microphones, sound ports are precisely engineered to deliver low distortion, high signal-to-noise ratios (SNR), and optimal acoustic transparency. In pressure sensors, accurate pressure coupling is maintained for consistent sensitivity and precision.
  • Standardized package designs streamline integration into PCB layouts for consumer, automotive, and industrial applications.
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MEMS Sensor Packages
MEMS Sensor Packages
MEMS Sensor Packages

Infineon¡¯s discrete IGBT power modules are designed to combine insulated-gate bipolar transistors (IGBTs) and freewheeling diodes in a single, compact package. These modules are optimized for high-efficiency power conversion and thermal management in medium- to high-power applications.

  • Integrated thermal management features, such as direct-bonded copper (DBC) substrates, ensure effective heat dissipation and long-term reliability.
  • Fast-switching capabilities reduce power losses, improving energy efficiency in systems like motor drives and HVAC systems.
  • Rugged designs ensure stable performance under fluctuating thermal and electrical stresses, making them suitable for demanding applications like railway traction and welding equipment.
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Molded Power Module
Molded Power Module
Molded Power Module

CSP technology offers a near-chip-size package, ensuring minimal footprint and high integration density.

  • Ideal for mobile and handheld devices due to the extremely compact form factor.
  • Lower parasitic effects, leading to better performance.
  • Cost-efficient for mass production in consumer electronics.
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Chip-Scale Packages
Chip-Scale Packages
Chip-Scale Packages