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P-TO252

Infineon surface mount transistor outline (TO) packages are offered as various families. Infineon TO SMD packages are available as DPAK and D2PAK with with a mold body size of approx. 6 to 9 mm. Infineon designations are following the standardized names TO-252 and TO-263 as given by JEDEC. PG-TO252 DPAK, PG-TO263 D2PAK. The I/O leads of the single-ended SMD packages are bent outwards from the package mold body side forming a distinct ¡°foot¡± and ¡°heel¡± geometry. That ¡°gullwing¡± shaped lead geometry can be mounted on the same board surface together with the heat sink pad using fully automated processes. The gullwing shaped leads altransistor for high-throughput board mounting using surface mount technology (SMT). Typical products are diodes, transistors, linear voltage regulators, switches, IGBT discretes, half-bridge ICs, linear drivers, and more.