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SLM 10TLC002L

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SLM 10TLC002L
SLM 10TLC002L

Product details

  • Additional Features
    CIPURSE?L profile, capability: 1 CIPURSE? application
  • Applications
    micropayment, transport ticketing, access management
  • Certifications
    CIPURSE?, NFC Forum Type 4 Tag
  • Delivery Forms
    MCC8, NiAu-bump, sawn wafer
  • EEPROM
    304 Byte
  • Interfaces
    ISO 14443 A, NFC Forum Type 4 Tag configurable
  • Package
    MCC8
  • Product Description
    CIPURSE?move, security architecture of CIPURSE?, built-in command set based on ISO 7816-4/-9, fully configurable file system based on ISO/ IEC 7816-4
  • Tools
    CIPURSE? development kit
  • Use Cases
    Public transport, ticketing, access management, micropayment
OPN
Product Status
Infineon Package
Package Name
Packing Size
Packing Type
Moisture Level
Moisture Packing
Lead-free
Halogen Free
RoHS Compliant
Infineon stock last updated:
The CIPURSE?move is a dedicated contactless security product designed for cost-optimized limited use tickets, and cards in transport ticketing applications. It features the CIPURSE?L profile and is compliant with the OSPT? Alliance CIPURSE?V2 Specification. This product is ideal for migrating from existing non-secure or legacy systems to a more advanced and state-of-the-art security architecture.

Features

  • 1 PxSE ADF configurable
  • Upto 3 elementary files per CIPURSE? ADF
  • Upto 2 128-bit AES keys per CIPURSE? ADF
  • Mutual authentication using AES-128
  • Configurable access rights for each file
  • Secure messaging with AES-MAC
  • DPA and DFA resistant
  • Chip capacitance of 17 pF

Applications

Documents

Design resources

Developer community

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