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Best choice for High Power Density & Cost Efficiency up to 60 A

Leading-edge Portfolio for Small & Cost-efficient Loads in Superior Automotive Quality

The success story of the Dual SSO8 5x6 leadless packages continues with a high performant Cu-clip and the latest OptiMOS 7??40 V technology as the leading-edge package for tomorrow's low to mid power applications like window-lift, power-lift gate, power-seat,
body control module, USB-charging, electric-parking brake, water pump or all other small BLDC drives loads.

Dual SSO8 5x6 with Cu-clip offers two integrated MOS channels with high current capability of 60 A each at a small footprint of 56 mm?.

Dual SSO8 5x6 in combination with the leading-edge OptiMOS-7? 40 V?power MOS technology combines for best-in-class power density and power efficiency at Infineon¡¯s high-quality standard for robust automotive packages.

Consequently, the innovative Dual SSO8 5x6 package family supersedes any traditional leaded SMD packages.

Further Dual SSO8 5x6 as leadless package minimizes stray inductances, package resistance and improves switching behavior over leaded packages significantly ¨C the perfect match for robust & easy system designs.

Dual SSO8 5x6 is listed under JEDEC standard PG-TDSON-8-60/61 as the open standard package.

For more information, please check our?product presentation!

Key features
  • 5x6 mm? small footprint
  • 60 A high current capability
  • Available in leading-edge OptiMOS-7? 40 V technology
  • RDS(on)?range: 1.9 m? ¨C 5.6 m?
  • Advanced leadless package with Cu-Clip for lowest package resistance and minimized stray inductance
  • High avalanche capability and SOA ruggedness
  • AOI capable package for Automated Optical Inspection
  • JEDEC registered
  • PPAP Capable Device
Key benefits
  • Highest power and current density?
  • High thermal capacity lead-frame package?
  • Reduced conduction losses?
  • Optimized switching behavior?
  • Reduced form factor compared to traditional leaded packages
  • Industry standard package
    (JEDEC standard PG-TDSON-8-60/61)
  • Automotive robust package & quality by Infineon
Key applications
  • all Body control modules
  • Window-lift
  • Power-lift gate
  • Power-seat
  • USB-charging
  • Water pump
  • Small BLDC drives

Package dimensions

PG-TDSON-8-61
PG-TDSON-8-61
PG-TDSON-8-61
Dimensions:
  • Body Length: 5.48 mm
  • Body Width: 5.15 mm
  • Min. Terminal Pitch: 1.27 mm?

Click here?for a detailed information on the Dual SSO8 5x6 footprint dimension s and PCB recommendations