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TO-leaded with Gullwing (TOLG)

OptiMOS? power MOSFETs in TO-Leaded with Gullwing (TOLG) package for higher thermal cycling on board performance

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Overview

The TOLG package offers the same high current and low-profile features as TO-Leadless (TOLL). The TOLG package is footprint-compatible with TOLL, with the additional feature of gullwing leads for high thermal cycling. The TOLG package allows excellent electrical performance compared to D2PAK 7-pin with ~60 percent board space reduction. This package offers very low RDS(on)and is optimized to handle high currents >300 A.

Key Features

  • High performance
  • High current rating >300 A
  • Low ringing and voltage overshoot
  • Optimized board utilization

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About

Broad portfolio of specified voltages between 60 V and 250 V

The OptiMOS? power MOSFET family in TOLG package is available in a broad portfolio of voltages including 60 V, 80 V, 100 V, 200 V, and 250 V. Key benefits of the TOLG package include high efficiency, lower EMI, and high-power density enabling high performance and overall system efficiency.

Compare TOLx products - TOLL, TOLT, and TOLG
High thermal cycling on board performance

During MOSFET operation, the silicon die is heating up and transferring heat to the PCB. Depending on the PCB core material, different levels of PCB heat expansion will occur. In the case of FR4 and Cu-IMS board, this expansion/deformation is not severe since the PCB is flexible and has the same CTE as the MOSFET package. However, in the case of the Al-IMS board, this deformation creates mechanical stress on the solder layer between the PCB and the MOSFET. Over time, this temperature cycling causes cracking of the solder joints and eventually leads to a failure.

The advantage of TOLG is particularly visible during Temperature Cycling on Board (TCoB), which is a second-level reliability test in which solder joints between the package and PCB are tested. Thanks to the flexibility of the gullwing leads, the new package shows excellent solder joint reliability on the Al-IMS board. This demonstrates two times better TCoB behavior compared to the standard requirement (IPC 9701).

Advantages OptiMOS??power MOSFETs in TO-Leaded with Gullwing package

TOLG has the same footprint (10x11x2.3 mm) and excellent performance of low resistance and high current capability of more than 300 A as TO-leadless. Furthermore, the great advantage of TOLG comes from the flexibility of the leads, which is a key feature of the?D?PAK 7-pin package. However, compared to D?PAK 7-pin, TOLG allows roughly 60 percent board space reduction resulting in the perfect solution for very compact designs. These features allow a reduction in conduction losses and lower EMI as well as improved PCB area utilization.

TOLx products - TOLL, TOLT and TOLG

Infineon's TOLx family of high current, high power density packages ¨C TO-Leadless (TOLL), TO-Leaded Top-Side Cooling (TOLT), and TO-Leaded with Gullwing leads (TOLG) ¨C addresses different requirements. The TOLL package features high power density, TOLG offers superior thermal cycling on board (TCoB), while TOLT offers superior thermal performance with minimal thermal resistance to the heatsink.

TOLx package family

Broad portfolio of specified voltages between 60 V and 250 V

The OptiMOS? power MOSFET family in TOLG package is available in a broad portfolio of voltages including 60 V, 80 V, 100 V, 200 V, and 250 V. Key benefits of the TOLG package include high efficiency, lower EMI, and high-power density enabling high performance and overall system efficiency.

Compare TOLx products - TOLL, TOLT, and TOLG

High thermal cycling on board performance

During MOSFET operation, the silicon die is heating up and transferring heat to the PCB. Depending on the PCB core material, different levels of PCB heat expansion will occur. In the case of FR4 and Cu-IMS board, this expansion/deformation is not severe since the PCB is flexible and has the same CTE as the MOSFET package. However, in the case of the Al-IMS board, this deformation creates mechanical stress on the solder layer between the PCB and the MOSFET. Over time, this temperature cycling causes cracking of the solder joints and eventually leads to a failure.

The advantage of TOLG is particularly visible during Temperature Cycling on Board (TCoB), which is a second-level reliability test in which solder joints between the package and PCB are tested. Thanks to the flexibility of the gullwing leads, the new package shows excellent solder joint reliability on the Al-IMS board. This demonstrates two times better TCoB behavior compared to the standard requirement (IPC 9701).

Advantages OptiMOS??power MOSFETs in TO-Leaded with Gullwing package

TOLG has the same footprint (10x11x2.3 mm) and excellent performance of low resistance and high current capability of more than 300 A as TO-leadless. Furthermore, the great advantage of TOLG comes from the flexibility of the leads, which is a key feature of the?D?PAK 7-pin package. However, compared to D?PAK 7-pin, TOLG allows roughly 60 percent board space reduction resulting in the perfect solution for very compact designs. These features allow a reduction in conduction losses and lower EMI as well as improved PCB area utilization.

TOLx products - TOLL, TOLT and TOLG

Infineon's TOLx family of high current, high power density packages ¨C TO-Leadless (TOLL), TO-Leaded Top-Side Cooling (TOLT), and TO-Leaded with Gullwing leads (TOLG) ¨C addresses different requirements. The TOLL package features high power density, TOLG offers superior thermal cycling on board (TCoB), while TOLT offers superior thermal performance with minimal thermal resistance to the heatsink.

TOLx package family

Documents

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Design resources

Developer community

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