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Active and preferred
RoHS Compliant
Lead-free

CYW20829

package
board
Multiple OPNs available
ea.

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CYW20829
CYW20829
ea.

Product details

  • Bluetooth Classic
    NO
  • Bluetooth LE RX Sensitivity
    -98 dBm (LE1M)
  • Bluetooth LE TX Power
    10 dbm
  • Bluetooth LE
    YES
  • Bluetooth Subsystem
    48 MHz ARM Cortex M33 supporting PAwR, LE Long Range, ISOC Channels, Advertisement Extensions
  • Cache
    32 kByte
  • CPU
    Arm? Cortex?-M33
  • Family
    AIROC? Bluetooth LE
  • Frequency
    48 MHz to 96 MHz
  • GPIOs
    32
  • Launch Date
    31-03-2024
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • MCU Subsystem
    ARM Cortex M33 configurable with 96/48 MHz
  • Operating Temperature
    -40 ¡ãC to 85 ¡ãC
  • Partner Module
    N
  • Peripherals
    CAN-FD, LIN, 11-bit ADC (Sigma Delta), Keyscan, DMA, RTC, I2C, UART, PDM, 9 timers
  • Currently planned availability until at least
    31-03-2039
  • RAM
    256 kByte
  • ROM
    64 kByte
  • Security
    Secure-boot, True Random Number Generator (TRNG), cryptographic hardware acceleration, encrypted image support for external flash
  • Sensitivity (best) (dBm)
    -106 (LE Coded PHY)
  • Supported Protocols
    Bluetooth Low Energy 5.4
  • Type
    Wireless MCU
Recommended
OPN
CYW20829B0LKMLXQLA1 CYW20829B0LKMLTXUMA1 CYW20829B0000XQLA1 CYW20829B0000XUMA1 CYW20829B0010XUMA1 CYW20829B0010XQLA1 CYW20829B1340XQSA1
Product Status active and preferred active and preferred active and preferred active and preferred active and preferred active and preferred coming soon coming soon
Infineon Package
PG-VQFN-56
PG-VQFN-56
PG-VQFN-56
PG-VQFN-56
PG-VQFN-56
PG-VQFN-56
PG-LFBGA-64 PG-LFBGA-64
Package Name QFN-56 (002-31757) QFN-56 (002-31757) QFN-56 (002-31757) QFN-56 (002-31757) QFN-56 (002-31757) QFN-56 (002-31757) N/A N/A
Packing Size 4900 2500 4900 2500 2500 4900 490 4500
Packing Type TRAY TAPE & REEL TRAY TAPE & REEL TAPE & REEL TRAY TRAY TAPE & REEL
Moisture Level 3 3 3 3 3 3 3 3
Moisture Packing DRY DRY DRY DRY DRY DRY DRY DRY
Lead-free Yes Yes Yes Yes Yes Yes Yes No
Halogen Free Yes Yes Yes Yes Yes Yes Yes Yes
RoHS Compliant Yes Yes Yes Yes Yes Yes Yes Yes
Infineon stock last updated:
 ea. in stock ea. in stock

Product Status
Active
Infineon Package
PG-VQFN-56
Package Name QFN-56 (002-31757)
Packing Size 4900
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status
Active
Infineon Package
PG-VQFN-56
Package Name QFN-56 (002-31757)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status
Active
Infineon Package
PG-VQFN-56
Package Name QFN-56 (002-31757)
Packing Size 4900
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package
PG-VQFN-56
Package Name QFN-56 (002-31757)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package
PG-VQFN-56
Package Name QFN-56 (002-31757)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package
PG-VQFN-56
Package Name QFN-56 (002-31757)
Packing Size 4900
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status coming soon
Infineon Package PG-LFBGA-64
Package Name -
Packing Size 490
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status coming soon
Infineon Package PG-LFBGA-64
Package Name -
Packing Size 4500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The AIROC? CYW20829 Bluetooth? LE MCU with its included peripheral support enables evaluation, prototyping, and development of a wide array of Bluetooth? Low Energy applications, all on Infineon¡¯s low power, high performance AIROC? CYW20829. The AIROC? CYW20829¡¯s robust RF performance and 10 dBm TX output power without an external power amplifier (PA).

Features

  • Highly integrated Bluetooth? LE 5.4 MCU
  • 96 MHz ARM Cortex M33 ¨C Application MCU
  • 48 MHz ARM Cortex M33 ¨C Bluetooth? Subsystem
  • 256 KB / 96 KB SRAM ¨C Bluetooth? LE
  • 48 MHz QSPI/SMIF with XIP, 32 KB Cache
  • On-the-fly encryption for off-chip Flash
  • Secure Boot & Crypto HW engine
  • TX Power: up to +10 dBm
  • Robust Receive sensitivity of -106 dBm
  • 1.7 to 3.6 V supply voltage range
  • 32 Programmable GPIO
  • Upto 85¡ãC operating temperature

Benefits

  • Industry¡¯s best range and noise immunity
  • Future proof your designs and unlock new use cases with Bluetooth LE 5.4
  • Reduce system cost with highly integrated MCU and ¡°right sized¡± external flash
  • Longer battery life with low power connection
  • No dongle for ultra low latency HID

Documents

Documents

Design resources

Partner solutions

Developer community

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