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CoolMOS? in ThinPAK 8x8

The leadless SMD package for CoolMOS? superjunction MOSFET

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Overview

Thin-PAK 8x8, a leadless SMD package for high voltage MOSFETs, has a footprint of only 64 mm? (vs. 150 mm? for D?PAK) and a thickness of only 1 mm (vs. 4.4 mm for D?PAK) - addressing the needs of modern power-density driven designs. ThinPAK 8x8 features a very low source inductance of 2 nH (vs. 6 nH for D2PAK) and a separate driver source connection (clean gate signal) with a similar thermal performance to that of D2PAK.?

Key Features

  • Small footprint (8x8 mm?)
  • Low profile (1 mm)
  • Low parasitic inductance
  • Separate driver source pin
  • RoHS compliant
  • Halogen-free mold compound
  • Clean switching waveform

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About

CoolMOS??in Thin-PAK 8x8

Thin-PAK contributes to increased power density by providing small board occupation combined with adequate thermal resistance to the board. The space-saving package is also routed for short commutation loops, facilitating a smooth switching waveform. A Kelvin source is provided for secure gate driving, catering also for scaling up through device paralleling.

The small thickness of the package accommodates specific assembly needs in high-density designs (server applications for example) where a modular approach is advantageous.

CoolMOS??in Thin-PAK 8x8

With a source inductance under 2 nH, Thin-PAK 8x8 minimizes the stray parasitics in the commutation loop, permitting accelerated current commutation. The resulting commutation waveforms are cleaner, implying a smaller EMI filtering effort and thus a smaller/lighter EMI filter. The Kelvin source pin additionally minimizes the effect of the switched current on the switching speed.

CoolMOS??in Thin-PAK 8x8

Thin-PAK 8x8 is used to package CoolMOS? C7, P6, P7, CFD, and CFD7 with voltage ranges of 600 V and 650 V and on-state resistances ranging from 60 m? to 365 m?. The portfolio is targeted towards server, adapter, lighting, and UPS applications.

CoolMOS??in Thin-PAK 8x8

Thin-PAK contributes to increased power density by providing small board occupation combined with adequate thermal resistance to the board. The space-saving package is also routed for short commutation loops, facilitating a smooth switching waveform. A Kelvin source is provided for secure gate driving, catering also for scaling up through device paralleling.

The small thickness of the package accommodates specific assembly needs in high-density designs (server applications for example) where a modular approach is advantageous.

CoolMOS??in Thin-PAK 8x8

With a source inductance under 2 nH, Thin-PAK 8x8 minimizes the stray parasitics in the commutation loop, permitting accelerated current commutation. The resulting commutation waveforms are cleaner, implying a smaller EMI filtering effort and thus a smaller/lighter EMI filter. The Kelvin source pin additionally minimizes the effect of the switched current on the switching speed.

CoolMOS??in Thin-PAK 8x8

Thin-PAK 8x8 is used to package CoolMOS? C7, P6, P7, CFD, and CFD7 with voltage ranges of 600 V and 650 V and on-state resistances ranging from 60 m? to 365 m?. The portfolio is targeted towards server, adapter, lighting, and UPS applications.

Documents

Documents

Design resources

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community ", "labelEn" : "Ask the community " }, { "link" : "none", "label" : "View all discussions ", "labelEn" : "View all discussions " } ] }