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PG-TQFP-144-27

Package details

  • Package Material
    PG
  • Package Family
    PG-TQFP
  • Terminals
    144
  • Variant
    27
  • Exposed Paddle
    Yes
  • Body Length (mm)
    16.0
  • Body Width (mm)
    16.0
  • Min. Terminal Pitch (mm)
    0.4
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    1400
    1
  • TRAY
    Pieces/Reel
    Reels/Box
     
    540
    6
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    1000
    1
    330
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

PG-TQFP-144-27_Package Outline
PG-TQFP-144-27_Package Outline
PG-TQFP-144-27_Package Outline PG-TQFP-144-27_Package Outline PG-TQFP-144-27_Package Outline
PG-TQFP-144-27_Tape and Reel PG-TQFP-144-27_Tape and Reel PG-TQFP-144-27_Tape and Reel
PG-TQFP-144-27_Bakeable Trays PG-TQFP-144-27_Bakeable Trays PG-TQFP-144-27_Bakeable Trays
PG-TQFP-144-27_Footprint Drawing PG-TQFP-144-27_Footprint Drawing PG-TQFP-144-27_Footprint Drawing

Documents and drawings