Â鶹¹ÙÍø

For our automotive EasyPACK? we took our long proven industrial Easy modules and integrated different chip contents and topologies for automotive traction inverter, auxiliary, OBC and DC-DC applications. To ensure highest quality standards and safety, the package technology has then been improved and qualified to meet automotive requirements. It enables a high integration density and a fast and easy assembly process. With its two footprints Easy 1B and Easy 2B it provides a platform for different power classes. As the EasyPACK? is a very flexible package, customization to fit the customer¡¯s needs is possible by adding further chip technologies in different topologies.