Â鶹¹ÙÍø

HybridPACK? Drive

HybridPACK? Drive with Si and SiC technology is Infineon¡¯s market-leading power module for traction inverters of electric vehicles

anchor

Overview

HybridPACK? Drive offers a compact and scalable power solution for hybrid and electric vehicle traction, ranging from 100 kW to 300 kW, within 750 V and 1200 V classes. It allows performance scaling with thermal stacks and chipsets, maintaining the same module footprint.

Key Features

  • Best-in-class Si and SiC technology
  • Benchmark performance and efficiency
  • Industry standard footprint
  • Scalability and ease of design
  • AQG324 automotive qualification

Â鶹¹ÙÍø

About

HybridPACK? Drive with best-in-class IGBT and SiC technology

The HybridPACK? Drive was first introduced in 2017, using Infineon¡¯s silicon EDT2 technology, specifically optimized to deliver the best efficiency on a real-world driving cycle. In 2021 Infineon introduced the new CoolSiC? version, based on Infineon¡¯s silicon carbide trench MOSFET structure. Compared to planar structures, the Trench enables a higher cell density, resulting in the best-in-class figure of merit.

More about CoolSiC?
Next generation EDT3 and CoolSiC?? G2 technology

In 2023, Infineon introduced the second generation of the power module: the HybridPACK? Drive G2, featuring advanced EDT3 IGBT and CoolSiC? G2 MOSFET chip technologies. With a power range of up to 300 kW, the HybridPACK?? Drive G2 provides higher ease-of-use and new features compared to its previous generation, such as an integration option for next-generation phase current sensor and on-chip temperature sensing for IGBT products, which enable system cost improvements. It also delivers higher performance and power density thanks to improved assembly and interconnect technology. By 2025, the HybridPACK? Drive G2 portfolio will expand to include different current ratings and voltage levels (750 V and 1200 V).

What are the benefits of Infineon's HybridPACK? Drive G1 and G2?
  • Most scalable power portfolio in the market with IGBT and CoolSiC? options in 1200 V and 750 V for various power classes, without need for major system redesign
  • HybridPACK? Drive G1: EDT2 and CoolSiC? chipset with high power density and soft switching behavior for ease of design for traction inverters in EVs
  • HybridPACK? Drive G2 continuing the success: EDT3 and CoolSiC? G2 technology with new benchmark performance and efficiency for improved cost/performance ratio
  • Full automotive qualification AQG324

HybridPACK? Drive with best-in-class IGBT and SiC technology

The HybridPACK? Drive was first introduced in 2017, using Infineon¡¯s silicon EDT2 technology, specifically optimized to deliver the best efficiency on a real-world driving cycle. In 2021 Infineon introduced the new CoolSiC? version, based on Infineon¡¯s silicon carbide trench MOSFET structure. Compared to planar structures, the Trench enables a higher cell density, resulting in the best-in-class figure of merit.

More about CoolSiC?

Next generation EDT3 and CoolSiC?? G2 technology

In 2023, Infineon introduced the second generation of the power module: the HybridPACK? Drive G2, featuring advanced EDT3 IGBT and CoolSiC? G2 MOSFET chip technologies. With a power range of up to 300 kW, the HybridPACK?? Drive G2 provides higher ease-of-use and new features compared to its previous generation, such as an integration option for next-generation phase current sensor and on-chip temperature sensing for IGBT products, which enable system cost improvements. It also delivers higher performance and power density thanks to improved assembly and interconnect technology. By 2025, the HybridPACK? Drive G2 portfolio will expand to include different current ratings and voltage levels (750 V and 1200 V).

What are the benefits of Infineon's HybridPACK? Drive G1 and G2?
  • Most scalable power portfolio in the market with IGBT and CoolSiC? options in 1200 V and 750 V for various power classes, without need for major system redesign
  • HybridPACK? Drive G1: EDT2 and CoolSiC? chipset with high power density and soft switching behavior for ease of design for traction inverters in EVs
  • HybridPACK? Drive G2 continuing the success: EDT3 and CoolSiC? G2 technology with new benchmark performance and efficiency for improved cost/performance ratio
  • Full automotive qualification AQG324

Documents

Documents

Design resources

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community ", "labelEn" : "Ask the community " }, { "link" : "none", "label" : "View all discussions ", "labelEn" : "View all discussions " } ] }