Âé¶¹¹ÙÍø

EasyPACK?

EasyPACK? is an easy-to-handle and efficient module for power inverters and converters up to 100 kW

anchor

Overview

For our automotive EasyPACK?, the package of the industrial Easy modules has been improved and qualified to meet automotive requirements. It enables a fast and easy assembly process. With its two footprints Easy 1B and Easy 2B, it provides a platform for different power classes using both of our leading IGBT and CoolSiC? technologies. Customizations to fit customer¡¯s needs are possible by adding further chip technologies in different topologies.

Key Features

  • Automotive qualified EasyPACK?
  • Available with Si IGBT and CoolSiC?
  • Fast and easy assembly process
  • Two footprints: Easy 1B and Easy 2B
  • PressFIT contact technology

Âé¶¹¹ÙÍø

About

  • Flexible module with different topologies, enabling different inverter geometries and further motor integration
  • PressFIT pins for ease of assembly for PCB mounting
  • Using Infineon's benchmark chip technologies matching specific application requirements
  • Cost-effective module
  • High volume manufacturing experience
  • Easy system assembly - PressFIT contact technology for solder-less mounting
  • Easy design ¨C integrated module solution with optimized thermal management
  • Reliability ¨C insulated solution with high creepage and clearance distances
  • Low stray inductance
  • Automotive EasyPACK? 1B and 2B provides a platform for flexible topologies from auxiliaries to inverters of high-voltage applications
  • Built upon on well-established industrial EasyPACK? version
  • Automotive EasyPACK? fully qualified and validated according to automotive standards to ensure reliable operation under harsh environmental conditions in high-voltage automotive applications
  • Automotive EasyPACK? helps you to simplify insulation, design, and assembly

  • Flexible module with different topologies, enabling different inverter geometries and further motor integration
  • PressFIT pins for ease of assembly for PCB mounting
  • Using Infineon's benchmark chip technologies matching specific application requirements
  • Cost-effective module
  • High volume manufacturing experience

  • Easy system assembly - PressFIT contact technology for solder-less mounting
  • Easy design ¨C integrated module solution with optimized thermal management
  • Reliability ¨C insulated solution with high creepage and clearance distances
  • Low stray inductance

  • Automotive EasyPACK? 1B and 2B provides a platform for flexible topologies from auxiliaries to inverters of high-voltage applications
  • Built upon on well-established industrial EasyPACK? version
  • Automotive EasyPACK? fully qualified and validated according to automotive standards to ensure reliable operation under harsh environmental conditions in high-voltage automotive applications
  • Automotive EasyPACK? helps you to simplify insulation, design, and assembly

Documents

Design resources

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community ", "labelEn" : "Ask the community " }, { "link" : "none", "label" : "View all discussions ", "labelEn" : "View all discussions " } ] }