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Best choice for tomorrows high power automotive applications up to 280 A

Highest power density & efficiency in superior automotive quality

The success story of sTOLL 7x8 leadless packages continues with the latest OptiMOS-7??40 V technology as the leading-edge package for tomorrow's high power applications like EPS, braking, power- distribution, disconnect-switches and high-power BLDC drives.

sTOLL 7x8 offers high current capability of 280 A, more than the old leaded D?PAK (180 A), at an optimized footprint of 56 mm? which is even smaller than the old leaded DPAK (65 mm?).

sTOLL 7x8 in combination with the leading-edge OptiMOS-7? 40 V?power MOS technology combines for best in class power density and power efficiency at Infineon¡¯s high-quality standard for robust automotive packages.

Consequently, the innovative sTOLL 7x8 package family supersedes the traditional leaded SMD packages like D?PAK (TO263) and DPAK (TO252) providing higher current capability in smaller form factor of 7x8 mm? at optimized thermal performance.

Further sTOLL 7x8 as leadless package minimizes stray inductances, package resistance and improves switching behavior over leaded packages significantly ¨C the perfect match for robust & easy system designs.

sTOLL 7x8 is listed under JEDEC standard name MO-319 and IEC name HSOF-5 as open standard package.

For more information, please check our?product presentation!

Key features
  • 7x8 mm? small footprint
  • 280 A high current capability
  • Available in leading-edge OptiMOS-7? 40 V technology
  • RDS(on)?range: 0.39 m? ¨C 1.4 m?
  • Advanced leadless package with Cu-Clip for the lowest package resistance and minimized stray inductance
  • High avalanche capability and SOA ruggedness
  • AOI capable package for Automated Optical Inspection
  • JEDEC registered
  • PPAP Capable Device
Key benefits
  • Highest power and current density?
  • High thermal capacity lead-frame package?
  • Reduced conduction losses?
  • Optimized switching behavior?
  • Reduced form factor compared to traditional leaded packages
  • Industry standard package (JEDEC MO-319A)
  • Automotive robust package and quality by Infineon
Key applications
  • 12 V EPS
  • 12 V braking
  • 12 V high power BLDC
  • Power distribution
  • Zonal-architecture designs
  • Battery disconnect switch
  • Relay box
  • DC-DC

Package dimensions

HSOF-5-1 Package
HSOF-5-1 Package
HSOF-5-1 Package
Dimensions:
  • Body Length: 6.7 mm
  • Body Width: 7 mm
  • Min. Terminal Pitch: 1.3 mm?

Click here for a detailed information on the sToll Package PG-HSOF-5-1.

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